Cure with Confidence: Tools and Models for Resin Process Control

The performance of the final product depends heavily on the degree of cure - making it critical to ensure that the reaction goes to completion for the highest quality and reliability.

Achieving this requires both a deep understanding of the resin’s curing behavior and precise control of process parameters. Tools such as differential scanning calorimetry (DSC), dielectric analysis (DEA) and oscillatory rheometry provide powerful ways to characterize thermal transitions, cure progression and flow behavior. Each method delivers distinct insights. In this presentation, NETZSCH will discuss when to use DSC, DEA or oscillatory rheometry.

These techniques also serve as the basis for kinetics analysis using Kinetics Neo software. Kinetics modeling allows simulation of resin behavior under any time or temperature conditions. This not only enables process optimization and consistent product performance but also helps reduce manufacturing variability and thus scrap rates by predicting and preventing potential processing issues.

Agenda: 

• Comparative use of DSC, DEA and oscillatory rheometry in thermoset cure characterization
• Kinetic modeling approaches for curing processes
• The role of vitrification as a critical parameter in cure analysis