AM In-Situ Process Monitoring with Backscattered Electron Imaging

In additive manufacturing (AM), part quality must be verified layer-by-layer to avoid costly reprinting and delays. Most AM systems rely on optical cameras for this but resolution and image evaluation for defects can be limited.

With electron beam powder bed fusion (EB-PBF), backscattered electron imaging (BEI) enables up to 100 times greater resolution and direct interaction with atoms in each layer, giving engineers precise, real-time insights into potential defects and layer integrity during their AM process.

Join Jeol’s webinar to explore how this advanced in-situ inspection method improves quality assurance and unlocks new efficiencies in AM production.

Agenda: 

• Why traditional camera-based monitoring in AM can have limitations in defect detection per layer
• How backscattered electron imaging provides higher resolution per layer through atomic interactions
• How EB-PBF enables real-time, layer-by-layer verification and subsequent defect correction
• How this approach enhances production reliability and part quality